On June 6, 2019, the Ministry of Industry and Information Technology officially issued 5G licenses to four companies, marking China’s official entry into the first year of 5G commercial use. As of the end of February 2021, China has built a total of 792,000 5G base stations, and the number of 5G terminal connections has reached 260 million, laying a solid foundation for the promotion of 5G applications.

With the large-scale construction of 5G network base stations, the accelerated popularization of 5G terminals, and the continuous development of application markets such as mobile Internet, industrial Internet, Internet of Things, and Internet of Vehicles, the industry’s demand for 5G new materials is growing. The increase in 5G communication transmission rate and signal strength requires circuit boards applied to base stations to have good transmission and heat dissipation performance, which requires the use of basic materials with higher dielectric properties.

With its excellent performance in terms of ultra-low dielectric loss and high stable dielectric constant performance, Holitech’s high-frequency and high-speed substrates greatly increase the signal transmission speed of smart terminals, reduce signal delay, and reduce signal loss, and fully meet the needs of operators and equipment manufacturers. Various application requirements of 5G materials.

High frequency and high speed substrate

AH30000 series-ceramic filled PTFE substrate

●Ultra low dielectric loss

●High stable dielectric constant

●Suitable for application scenarios with complex environments and strict reliability requirements such as automotive millimeter wave radar, aerospace, military products, etc.

AH21000 Series-Hydrocarbon Ceramic Laminate Material

●Ultra low dielectric loss

●High stable dielectric constant

●Compatible with traditional FR4 processing technology

●Suitable for 5G base stations, 24GHz millimeter wave radar, industrial control, smart transportation, smart medical and other application scenarios

5G not only brings new challenges and development opportunities for basic materials, but also drives the innovation of antenna technology. Due to the characteristics of 5G high-speed and high-frequency, the signal frequency of terminal antennas such as smartphones is constantly increasing. In order to ensure reliability and reduce signal loss during transmission, 5G communication has more indicators for the dielectric constant and dielectric loss factor of the antenna material.

At present, mobile phone antennas in the 4G era mainly use PI substrates. However, due to the large water absorption rate of PI substrates, the dielectric constant and dielectric loss factor are also large, especially for products with operating frequencies exceeding 10GHz, it is not suitable for the 5G era. In the mobile phone antenna scenario, new antenna materials and manufacturing processes must be adopted. In the end, LCP stood out with its excellent performance and became a new material adapted to 5G antenna technology.

At present, the LCP antenna industry chain is mainly dominated by foreign manufacturers, and the particularity of LCP processing makes module manufacturing a major difficulty for LCP antennas. Holitech is one of the few companies in the world that master the mass production technology of LCP multilayer flexible antennas and feeders, and it is also one of the few domestic manufacturers with large-scale production capabilities. In recent years, the company has achieved continuous breakthroughs in LCP antenna/feeder process capabilities and material technology, empowering customers to build core competitiveness in the 5G era and occupy a new high ground in the 5G era.

LCP/MPI multilayer flexible antenna/feeder

●Based on polymer co-sintering technology (HTCP) to achieve high multi-layer structure and complex inner layer interconnection

●It has the advantages of high integration, space saving, and excellent RF performance

●Suitable for 5G antenna/feeder scenarios of consumer electronic terminals such as smart phones and smart wearables

For more information about Holitech’s new 5G materials, please pay attention to the Digital China Construction Achievement Exhibition and Digital Products Expo held at the Fuzhou Strait International Convention and Exhibition Center from April 25th to 29th. As a leading solution provider and manufacturer in the intelligent terminal industry chain, Holitech brought 5G new materials, FPCs, new displays, cameras and other core products to its brilliant appearance, and explored the deep integration of mobile intelligence with many technology enthusiasts on the spot, releasing innovative wisdom.