MWC accelerates detonation of 5G era Holitech advances layout…

Obviously, the development opportunities brought about by the 5G era are infinite. The relevant manufacturers in the mobile phone industry supply chain are aiming at the future market development, and they are arranging the 5G industry to strive to share the market dividend brought by the 5G “big cake”. Recently, Holitech, a well-known supplier of intelligent terminal parts in China, said that the company has made strategic plans and reserves for 5G terminal related materials in advance, and regarded it as an important direction for the company’s future development.

New elements of traditional products in the 5G process

As we all know, the 5G era is coming, it is more powerful in data collection and cloud big data processing, with higher communication frequency, larger bandwidth and faster response. Therefore, the performance and anti-interference requirements of each smart component in the smart terminal products in the 5G market will increase. The high-frequency and high-speed of electronic circuits puts higher requirements on the circuit board of intelligent terminals. Traditional FR4 and PI can no longer be used as carriers for high-frequency high-speed circuits, which will cause information distortion, low response speed and higher. System energy dissipation.

In addition, due to the change of the mobile phone from front to back single-shot to double-shot, the mobile phone replaces the SLR camera requirements, the fast update to three and four cameras, and the secure identification application such as Face ID that needs to quickly process large amounts of information, large-scale images. The demand for processing and high pixel content is constantly emerging, which also exacerbates the urgent need for high information volume and fast transmission. Traditional modular products also need high-frequency high-speed transmission capability to adapt to the future 5G communication requirements and obtain a perfect 5G experience.

High-screen ratio and AMOLED display are the development direction of future mobile phones. The high screen ratio leads to less space, and the increase in lines brought by high-pixel AMOLED makes COF an inevitable driver IC package for full-screen and AMOLED screens. There are no companies in the mainland that have COF technology and production capacity, especially the supply of double-sided COF. At the moment when domestic giants have launched OLEDs, there is a supply chain vacuum in COF products. In addition, in view of the high-frequency and high-speed characteristics of the 5G and the increase in the size of the display screen, the loss of power consumption is also drastically increased. The necessity of wireless charging will also be fully reflected in the 5G era, and the use of fragmentation time to charge the mobile phone anytime and anywhere will greatly support 5G applications.

Holitech, the core product at the beginning of its listing in 2014, is a touch screen and small and medium-sized LCD screens and modules. In the past few years, through the acquisition, cooperation, investment and other ways to continuously expand and improve the camera (including dual camera), biometrics, 3D glass cover, wireless charging module, all aspects of the business, has become the industry A few companies with intelligent terminal industry chain and design and mass production capabilities. Based on this, Holitech has strengthened the necessary components and materials for each intelligent terminal in the 5G era in various fields. It is worth mentioning that the author has obtained information and learned that Holitech has taken the lead in launching the strategic layout of the 5G market in 2017.

Master the core material technology layout 5G terminal

Holitech holds Shanghai Adel-link Technology Co., Ltd. (hereinafter referred to as “Adel-link”) through its subsidiary BYD Electronics. Shanghai Adel-link Technology Co., Ltd. is a high-tech enterprise with material technology as its core, high-frequency high-speed flexible circuit board and integrated circuit package substrate as the main application industry. The company has applied for more than 20 invention patents in high-frequency materials, high-frequency flexible circuit production, and new IC packaging, and has authorized 5 articles. At present, only a few companies in the world have mastered the high-frequency LCP flexible antenna mass production technology, and Adel-link is one of the companies with multi-layer LCP production technology.

LCP has a low dielectric constant and low dielectric loss. It can carry several transmission lines in a 3-layer structure of only 0.2 mm and take out multiple RF lines together, thus replacing the thick multi-coaxial cable, which can not only reduce 65. % feeder thickness, with higher space efficiency, and better overall cost, is the best choice for 5G high-frequency flexible lines.

At the same time, because the 90% screen ratio display is the development direction of the future mobile phone, COF is an essential material for the future 5G standard OLED display, which is also the company’s current development direction. Holitech utilizes unique ultra-precision mold technology and fine image transfer technology to achieve the finest line width and line spacing of 2 microns, far exceeding the technical capabilities disclosed on the market. At present, it has invested in a 1000-mu COF and high-frequency materials industrial park in Jiangxi Xinfeng.

The 5G related materials and technologies mastered by Holitech can promote the development of the company in the 5G era, and quickly apply to the company’s current industry-leading comprehensive screen modules, camera modules and other products. In the replacement of the 5G era, we seized the opportunity to maintain the leading position in the industry and build the core competitiveness of the 5G era.

Correspondingly, under the wave of the 5G era, ultra-fine line high-order FPC, wireless charging supporting materials, high-frequency high-speed materials, and absorbing materials have become indispensable materials for constructing the 5G market. Holitech will also open a new chapter in the field of circuit boards, wireless charging, and 5G materials.

Overall, with the addition of Adel-link, the development speed of Holitech will be in full swing. In addition, Holitech laid the foundation for the overall supporting update of the intelligent terminal 5G through the strategic layout of 5G related materials. Looking forward to the future, Holitech is expected to take the lead in occupying the dominant position in the next wave of industry changes and enjoy the industry dividend.